表面黏著技術 - 檢查機 回上一頁
3D錫膏檢測機
NEW
YSi-SP

YSi-SP

  • “1-head solution” to perform various inspections with a single head
  • Achieves high-accuracy high-speed inspections using 3D+2D inspection, image resolution switch-over and more
  • A thorough and extensive machine-to-machine (M2M) solution
  • Statistical Process Control (SPC) for diverse statistical processing
  • Optional features to enable handling various products
基本規格

 

 

YSi-SP

Applicable PCB

L510×W460mmL50×W50mm (single lane spec)
*No dual lane specification available.

 

Horizontal resolution (FOV size)

125µm / 12.5µm (approx. 50×50mm)
220µm / 10µm (approx. 40×40mm)
315µm / 7.5µm (approx. 30×30mm)
*All are standard selection type.

 

Height resolution

1µm

 

Inspection items

Solder paste printing quality (volume, height, area and misalignment)

 

Power supply

Single-phase AC 200V–230V ±10%

 

Air supply source

Airless specification

 

External dimension

L904×W1,080×H1,478 mm

 

Weight

Approx. 550 kg

 

Specifications and appearance are subject to change without prior notice.