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3D錫膏檢測機
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YSi-SP

YSi-SP

  • “1-head solution” to perform various inspections with a single head
  • Achieves high-accuracy high-speed inspections using 3D+2D inspection, image resolution switch-over and more
  • A thorough and extensive machine-to-machine (M2M) solution
  • Statistical Process Control (SPC) for diverse statistical processing
  • Optional features to enable handling various products
基本規格

 

 

YSi-SP

Applicable PCB

L510×W460mm～L50×W50mm (single lane spec)
*No dual lane specification available.

  

Horizontal resolution (FOV size)

1）25µm / 12.5µm (approx. 50×50mm)
2）20µm / 10µm (approx. 40×40mm)
3）15µm / 7.5µm (approx. 30×30mm)
*All are standard selection type.

  

Height resolution

1µm

  

Inspection items

Solder paste printing quality (volume, height, area and misalignment)

  

Power supply

Single-phase AC 200V–230V ±10%

  

Air supply source

Airless specification

  

External dimension

L904×W1,080×H1,478 mm

  

Weight

Approx. 550 kg

  

Specifications and appearance are subject to change without prior notice. 

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