3D Solder Paste Inspection Machine
NEW
YSi-SP
- “1-head solution” to perform various inspections with a single head
- Achieves high-accuracy high-speed inspections using 3D+2D inspection, image resolution switch-over and more
- A thorough and extensive machine-to-machine (M2M) solution
- Statistical Process Control (SPC) for diverse statistical processing
- Optional features to enable handling various products
specifications
YSi-SP |
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Applicable PCB |
L510×W460mm~L50×W50mm (single lane spec) |
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Horizontal resolution (FOV size) |
1)25µm / 12.5µm (approx. 50×50mm) |
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Height resolution |
1µm |
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Inspection items |
Solder paste printing quality (volume, height, area and misalignment) |
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Power supply |
Single-phase AC 200V–230V ±10% |
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Air supply source |
Airless specification |
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External dimension |
L904×W1,080×H1,478 mm |
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Weight |
Approx. 550 kg |
Specifications and appearance are subject to change without prior notice.