對象基板尺寸

L50 x W30mm to L330 x W250mm

基板厚度

0.1 to 4.0mm

基板傳送方向

Left ⇒ Right (option : Right ⇒ Left)

傳送帶基準

Front

貼裝精度(Cpk ≧1.0)

±15μm

貼裝能力

10,800 CPH (when die is supplied from wafer) Note : under optimum conditions

元件種類數量

Reel : Max. 48 types (conversion for 8mm tape feeder)

Wafer : Max. 10 types

Die

晶片尺吋

□0.35 to □16mm Note

晶片厚度

0.1 to 0.5mm Note

晶圓尺寸

6 to 8 inch wafers, 2 to 4 inch waffle trays

晶圓料盒

Wafer : Max. 10 types

SMD

元件尺寸

0201 to □16mm, H15mm (multi camera)

0201 to □12mm, H6.5mm (scan camera)

料帶尺寸

8 to 104mm

最大feeder裝備配量

Max. 48 types (for 8mm feeder)

□0.35 to □16mm Note

電源規格

3-phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz

供給氣源

0.45 MPa or more, in clean, dry state

外形尺寸

L1,252 x W1,962 x H1,853mm

主體重量

Approx. 1,560kg