- Mixed mounting of semiconductor and SMD
- High-speed and high-accuracy mounting
- Available for intelligent feeder and various options
- Applicable for various production processes
YRH10 |
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Applicable PCB |
L50 x W30mm to L330 x W250mm |
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PCB thickness |
0.1 to 4.0mm |
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PCB conveyance direction |
Left ⇒ Right (option : Right ⇒ Left) |
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Conveyer reference |
Front |
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Mounting accuracy (Cpk ≧1.0) |
±15μm |
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Mounting capability |
10,800 CPH (when die is supplied from wafer) Note : under optimum conditions |
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Number of component types |
Reel : Max. 48 types (conversion for 8mm tape feeder) Wafer : Max. 10 types |
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Die |
Die size |
□0.35 to □16mm Note |
Die thickness |
0.1 to 0.5mm Note |
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Wafer size |
6 to 8 inch wafers, 2 to 4 inch waffle trays |
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Wafer magazine |
Wafer : Max. 10 types |
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SMD |
Component size |
0201 to □16mm, H15mm (multi camera) 0201 to □12mm, H6.5mm (scan camera) |
Tape size |
8 to 104mm |
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Max feeder count |
Max. 48 types (for 8mm feeder) |
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□0.35 to □16mm Note |
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Power supply |
3-phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz |
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Air supply source |
0.45 MPa or more, in clean, dry state |
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External dimension |
L1,252 x W1,962 x H1,853mm |
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Weight |
Approx. 1,560kg |
Specifications and appearance are subject to change without prior notice.