Yamaha SMT Equipment - Flip Chip Bonder BACK
YRH10
HOT
YRH10
  • Mixed mounting of semiconductor and SMD
  • High-speed and high-accuracy mounting
  • Available for intelligent feeder and various options
  • Applicable for various production processes
specifications
 

YRH10

Applicable PCB

L50 x W30mm to L330 x W250mm

PCB thickness

0.1 to 4.0mm

PCB conveyance direction

Left Right (option : Right Left)

Conveyer reference

Front

Mounting accuracy (Cpk 1.0)

±15μm

Mounting capability

10,800 CPH (when die is supplied from wafer) Note : under optimum conditions

Number of component types

Reel : Max. 48 types (conversion for 8mm tape feeder)

Wafer : Max. 10 types

Die

Die size

□0.35 to □16mm Note

Die thickness

0.1 to 0.5mm Note

Wafer size

6 to 8 inch wafers, 2 to 4 inch waffle trays

Wafer magazine

Wafer : Max. 10 types

SMD

Component size

0201 to □16mm, H15mm (multi camera)

0201 to □12mm, H6.5mm (scan camera)

Tape size

8 to 104mm

Max feeder count

Max. 48 types (for 8mm feeder)

□0.35 to □16mm Note

Power supply

3-phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz

Air supply source

0.45 MPa or more, in clean, dry state

External dimension

L1,252 x W1,962 x H1,853mm

Weight

Approx. 1,560kg

Specifications and appearance are subject to change without prior notice.